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	Diamond electronic packages featuring bonded metal
	LEWIS, ELLIOTT; KOBA, RICHARD; WOODIN, RICHARD, L.
	1997-02-13
著作权人	CRYSTALLINE MATERIALS CORPORATION
专利号	WO1997005757A1
国家	世界知识产权组织
文献子类	发明申请
其他题名	Diamond electronic packages featuring bonded metal
英文摘要	The present invention pertains to the packaging of electronic circuit. More particularly, the present invention pertains to methods for adherently bonding metals (4) to diamond (1) (i.e. the formation of a metal-diamond bonded structure) to yield metal-diamond substrates which are suitable for use in the fabrication of electronic packaging. These metal-diamond substrates exhibit both high thermal conductivity and dielectric isolation (where necessary), while being compatible with electronic package fabrication and the attachment of most semiconductor devices. The methods of the present invention include the formation of adherently bonded metal (5) by: the metallization of a bare diamond surface by the deposition of base coat or primer coat comprising certain carbide-forming metals such as molybdenum and tungsten; the metalization of a bare diamond surface using an active braze alloy; and by the growth of a diamond layer on a carbide-forming substrate by chemical vapor deposition (CVD).
公开日期	1997-02-13
申请日期	1996-07-31
状态	未确认
内容类型	专利
源URL	[http://ir.opt.ac.cn/handle/181661/52058]
专题	半导体激光器专利数据库
作者单位	CRYSTALLINE MATERIALS CORPORATION
推荐引用方式 GB/T 7714	LEWIS, ELLIOTT,KOBA, RICHARD,WOODIN, RICHARD, L.. Diamond electronic packages featuring bonded metal. WO1997005757A1. 1997-02-13.

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