| Submount for semiconductor laser element | |
| ISHII MITSUO | |
| 1992-12-07 | |
| 著作权人 | MITSUBISHI ELECTRIC CORP |
| 专利号 | JP1992352376A |
| 国家 | 日本 |
| 文献子类 | 发明申请 |
| 其他题名 | Submount for semiconductor laser element |
| 英文摘要 | PURPOSE:To eliminate that a die-bonded solder comes into contact with a junction part including an active layer and blocks off a laser beam when a J/D is assembled in order to obtain a low heat resistance and a low drooping characteristic. CONSTITUTION:A protruding part 3 which has been formed to be high as compared with its peripheral region is formed only in a position in which a semiconductor laser chip 1 is die-bonded on the surface of a submount 2. |
| 公开日期 | 1992-12-07 |
| 申请日期 | 1991-05-29 |
| 状态 | 失效 |
| 内容类型 | 专利 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/50708]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | MITSUBISHI ELECTRIC CORP |
| 推荐引用方式 GB/T 7714 | ISHII MITSUO. Submount for semiconductor laser element. JP1992352376A. 1992-12-07. |
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