Fabrication of semiconductor light emitting device
SANADA TATSUYUKI; FURUYA AKIRA
1992-10-16
著作权人FUJITSU LTD
专利号JP1992291979A
国家日本
文献子类发明申请
其他题名Fabrication of semiconductor light emitting device
英文摘要PURPOSE:To improve the characteristics of a semiconductor laser in the information of a semiconductor layer electrode structure by preventing an active laser from a cleavage part upon a high-melting-point contact metal layer from being damaged to prevent the deterioration of device characteristics and make uniform an injected current for improvement of a heat dissipation characteristic. CONSTITUTION:The surface of a semiconductor laser body is covered with an SiO2 film 16, and a stripe window 17 is opened. A high melting point contact metal layer is formed by covering with a Ti film 18 and a Pt film 19. The surface of the metal layer is covered with an Au film. Au plating 21 is formed through selective plating. An Au film 20 of a predetermined width part (in the vicinity of a cleavage portion) on the stripe window is left behind, and the Au film other than the foregoing portion is removed. The high-melting-point contact metal layer (Pt film 19, Ti film) is etched and removed by reactive ion etching (IBE) using the Au plating 21 as a mask.
公开日期1992-10-16
申请日期1991-03-20
状态失效
内容类型专利
源URL[http://ir.opt.ac.cn/handle/181661/50687]  
专题半导体激光器专利数据库
作者单位FUJITSU LTD
推荐引用方式
GB/T 7714
SANADA TATSUYUKI,FURUYA AKIRA. Fabrication of semiconductor light emitting device. JP1992291979A. 1992-10-16.
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