Fabrication of semiconductor light emitting device | |
SANADA TATSUYUKI; FURUYA AKIRA | |
1992-10-16 | |
著作权人 | FUJITSU LTD |
专利号 | JP1992291979A |
国家 | 日本 |
文献子类 | 发明申请 |
其他题名 | Fabrication of semiconductor light emitting device |
英文摘要 | PURPOSE:To improve the characteristics of a semiconductor laser in the information of a semiconductor layer electrode structure by preventing an active laser from a cleavage part upon a high-melting-point contact metal layer from being damaged to prevent the deterioration of device characteristics and make uniform an injected current for improvement of a heat dissipation characteristic. CONSTITUTION:The surface of a semiconductor laser body is covered with an SiO2 film 16, and a stripe window 17 is opened. A high melting point contact metal layer is formed by covering with a Ti film 18 and a Pt film 19. The surface of the metal layer is covered with an Au film. Au plating 21 is formed through selective plating. An Au film 20 of a predetermined width part (in the vicinity of a cleavage portion) on the stripe window is left behind, and the Au film other than the foregoing portion is removed. The high-melting-point contact metal layer (Pt film 19, Ti film) is etched and removed by reactive ion etching (IBE) using the Au plating 21 as a mask. |
公开日期 | 1992-10-16 |
申请日期 | 1991-03-20 |
状态 | 失效 |
内容类型 | 专利 |
源URL | [http://ir.opt.ac.cn/handle/181661/50687] |
专题 | 半导体激光器专利数据库 |
作者单位 | FUJITSU LTD |
推荐引用方式 GB/T 7714 | SANADA TATSUYUKI,FURUYA AKIRA. Fabrication of semiconductor light emitting device. JP1992291979A. 1992-10-16. |
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