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	Laser diode assembly
	LELL, ALFRED; TAUTZ, SOENKE; STRAUSS, UWE; VIERHEILIG, CLEMENS
	2014-05-27
著作权人	OSRAM OPTO SEMICONDUCTORS GMBH
专利号	US8737445
国家	美国
文献子类	授权发明
其他题名	Laser diode assembly
英文摘要	A laser diode assembly includes a housing having a housing part and a mounting part, which is connected to the housing part and which extends away from the housing part along an extension direction. A laser diode chip is disposed on the mounting part. The laser diode chip has, on a substrate, semiconductor layers with an active layer for emitting light. The housing part and the mounting part have a main body composed of copper and at least the housing part is steel-sheathed. A first solder layer having a thickness of greater than or equal to 2 μm is arranged between the laser diode chip and the mounting part. The laser diode chip has a radiation coupling-out area, on which a crystalline protective layer is applied.
公开日期	2014-05-27
申请日期	2013-04-04
状态	授权
内容类型	专利
源URL	[http://ir.opt.ac.cn/handle/181661/47215]
专题	半导体激光器专利数据库
作者单位	OSRAM OPTO SEMICONDUCTORS GMBH
推荐引用方式 GB/T 7714	LELL, ALFRED,TAUTZ, SOENKE,STRAUSS, UWE,et al. Laser diode assembly. US8737445. 2014-05-27.

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