Purging: a reliability assurance technique for semiconductor lasers utilizing a purging process
GORDON, EUGENE I.; HARTMAN, ROBERT L.; NASH, FRANKLIN R.
1986-03-04
著作权人BELL TELEPHONE LABORATORES, INCORPORATED A CORP. OF NY
专利号US4573255
国家美国
文献子类授权发明
其他题名Purging: a reliability assurance technique for semiconductor lasers utilizing a purging process
英文摘要Prior to packaging, semiconductor lasers are purged by being subjected first to high temperature and high current simultaneously so as to suppress stimulated emission and stress the shunt paths which allow leakage current to flow around the active region. A prudent, but nonessential, second step is to lower the temperature and/or current so that the lasers emit stimulated emission (preferably strongly, near the peak output power), thereby stressing the active region. Lasers subjected to such a purge exhibit stabilized degradation rates in short times (of the order of a few hours) and provide a robust population which meets the performance criteria of long lifetime systems.
公开日期1986-03-04
申请日期1984-03-22
状态失效
内容类型专利
源URL[http://ir.opt.ac.cn/handle/181661/46268]  
专题半导体激光器专利数据库
作者单位BELL TELEPHONE LABORATORES, INCORPORATED A CORP. OF NY
推荐引用方式
GB/T 7714
GORDON, EUGENE I.,HARTMAN, ROBERT L.,NASH, FRANKLIN R.. Purging: a reliability assurance technique for semiconductor lasers utilizing a purging process. US4573255. 1986-03-04.
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