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	Fabricating methods of photoelectric devices and package structures thereof
	TSENG, WEN LIANG; CHEN, LUNG HSIN
著作权人	ADVANCED OPTOELECTRONIC TECHNOLOGY INC.
专利号	US20090152665A1
国家	美国
文献子类	发明申请
其他题名	Fabricating methods of photoelectric devices and package structures thereof
英文摘要	The invention discloses a method for fabricating a photoelectric device. A ceramic substrate is first provided, and then a first patterned electrode and a second patterned electrode are formed on and underneath the surface of the ceramic substrate. A plurality of photoelectric devices is sequentially connected to the first electrode layer with a wire solder or a eutectic joint method. The encapsulation materials cover the each photoelectric die to prevent damaged from the external force or environment. Cutting the ceramic substrate along the spaces between the photoelectric dies forms a plurality of independent package units.
公开日期	2009-06-18
申请日期	2008-12-11
状态	失效
内容类型	专利
源URL	[http://ir.opt.ac.cn/handle/181661/43583]
专题	半导体激光器专利数据库
作者单位	ADVANCED OPTOELECTRONIC TECHNOLOGY INC.
推荐引用方式 GB/T 7714	TSENG, WEN LIANG,CHEN, LUNG HSIN. Fabricating methods of photoelectric devices and package structures thereof. US20090152665A1.

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