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	Package structure and method for making the same
	LEE, CHENKUO; YI-MOU, HUANG
著作权人	ASIA PACIFIC MICROSYSTEMS, INC.
专利号	US20040087043A1
国家	美国
文献子类	发明申请
其他题名	Package structure and method for making the same
英文摘要	A package structure and method for making devices of system-in-a-package (SiP). Substrates with integrated and assembled elements can be aligned and pre-bonded together, and fluidic encapsulating materials is applied to seal the rest opening of pre-bonded interface of substrates. Three dimensional and protruding microstructures, elements, and MEMS devices can be accommodated and protected inside a spatial space formed by the bonded substrates. By applying the technologies of flip-chip, chip-scale-packaging, and wafer-level-packaging in conjunction with present invention, then plural elements and devices can be packaged together and become a system device in wafer-level-system-in-a-package (WLSiP) format.
公开日期	2004-05-06
申请日期	2002-10-30
状态	授权
内容类型	专利
源URL	[http://ir.opt.ac.cn/handle/181661/43446]
专题	半导体激光器专利数据库
作者单位	ASIA PACIFIC MICROSYSTEMS, INC.
推荐引用方式 GB/T 7714	LEE, CHENKUO,YI-MOU, HUANG. Package structure and method for making the same. US20040087043A1.

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