| Mechanical and Electrical Reliability Assessment of Bump-less Wafer-on-Wafer Integration with One-time Bottom-up TSV Filling | |
| Guan, Yong; Zhu, Yunhui; Zeng, Qinghua; Ma, Shenglin; Su, Fei; Bian, Yuan; Zhong, Xiao; Chen, Jing; Jin, Yufeng | |
| 2015 | |
| 会议名称 | 2015 IEEE 65TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC) |
| 会议日期 | 2015-01-01 |
| 卷号 | 2015-July |
| 页码 | 816-821 |
| 收录类别 | EI ; CPCI-S |
| URL标识 | 查看原文 |
| WOS记录号 | WOS:000370285100125 |
| 内容类型 | 会议论文 |
| URI标识 | http://www.corc.org.cn/handle/1471x/6536400 |
| 专题 | 北京航空航天大学 |
| 推荐引用方式 GB/T 7714 | Guan, Yong,Zhu, Yunhui,Zeng, Qinghua,et al. Mechanical and Electrical Reliability Assessment of Bump-less Wafer-on-Wafer Integration with One-time Bottom-up TSV Filling[C]. 见:2015 IEEE 65TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC). 2015-01-01. |
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