QQ客服 官方微博 反馈留言

	Multiphysics modeling approach for micro electro-thermo-mechanical actuator: Failure mechanisms coupled analysis
	Wang, Jinling; Zeng, Shengkui; Silberschmidt, Vadim V.; Guo, Jianbin
刊名	MICROELECTRONICS RELIABILITY
	2015
卷号	55页码:771-782
关键词	mu ETMA Multiphysics modeling FMMEA Coupled failure mechanisms
ISSN号	0026-2714
DOI	10.1016/j.microrel.2015.02.012
URL标识	查看原文
收录类别	SCIE
WOS记录号	WOS:000353742000009
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/6535949
专题	北京航空航天大学
推荐引用方式 GB/T 7714	Wang, Jinling,Zeng, Shengkui,Silberschmidt, Vadim V.,et al. Multiphysics modeling approach for micro electro-thermo-mechanical actuator: Failure mechanisms coupled analysis[J]. MICROELECTRONICS RELIABILITY,2015,55:771-782.
APA	Wang, Jinling,Zeng, Shengkui,Silberschmidt, Vadim V.,&Guo, Jianbin.(2015).Multiphysics modeling approach for micro electro-thermo-mechanical actuator: Failure mechanisms coupled analysis.MICROELECTRONICS RELIABILITY,55,771-782.
MLA	Wang, Jinling,et al."Multiphysics modeling approach for micro electro-thermo-mechanical actuator: Failure mechanisms coupled analysis".MICROELECTRONICS RELIABILITY 55(2015):771-782.

个性服务

查看访问统计

相关权益政策

暂无数据

收藏/分享

除非特别说明，本系统中所有内容都受版权保护，并保留所有权利。