| The wettability and microstructure of Sn-Zn-RE alloys | |
| Wu, CML; Law, CMT; Yu, DQ; Wang, L | |
| 刊名 | JOURNAL OF ELECTRONIC MATERIALS
 |
| 2003 | |
| 卷号 | 32页码:63-69 |
| 关键词 | lead-free solder Sn-9Zn rare earth wetting force wetting time contact angle microhardness |
| ISSN号 | 0361-5235 |
| URL标识 | 查看原文 |
| 内容类型 | 期刊论文 |
| URI标识 | http://www.corc.org.cn/handle/1471x/6204639 |
| 专题 | 大连理工大学 |
| 作者单位 | 1.City Univ Hong Kong, Dept Phys & Mat Sci, Hong Kong, Hong Kong, Peoples R China. 2.Dalian Univ Technol, Dept Mat Engn, Dalian 116024, Peoples R China. |
| 推荐引用方式 GB/T 7714 | Wu, CML,Law, CMT,Yu, DQ,et al. The wettability and microstructure of Sn-Zn-RE alloys[J]. JOURNAL OF ELECTRONIC MATERIALS,2003,32:63-69. |
| APA | Wu, CML,Law, CMT,Yu, DQ,&Wang, L.(2003).The wettability and microstructure of Sn-Zn-RE alloys.JOURNAL OF ELECTRONIC MATERIALS,32,63-69. |
| MLA | Wu, CML,et al."The wettability and microstructure of Sn-Zn-RE alloys".JOURNAL OF ELECTRONIC MATERIALS 32(2003):63-69. |
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