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	Study on the influence and disposal method of the micro-cracks of optical components (EI CONFERENCE)
	Chen X.-P. ; Xuan B. ; Wang P. ; Li J.-F. ; Song S.-M. ; Zhang H. ; Xie J.-J.
	2009
会议名称	4th International Symposium on Advanced Optical Manufacturing and Testing Technologies: Advanced Optical Manufacturing Technologies, November 19, 2008 - November 21, 2008
会议地点	Chengdu, China
关键词	Micro-crack is one of the most effective factor to the intensity and service life of optical components. Owing to the micro-crack on surface actual strength of optical components is reduced severely even less than ten-percent of its theoretical strength. According to fracture mechanics the mechanisms of the formation and propagation of micro-crack and the growth theory of sub-critical micro-crack are discussed in the paper firstly. Based on practice an on-line test method disposing etching holes-the molecule-infiltrating method and the principles of acid-etching method disposing micro-crack are described. Followed by the demolishing mechanism of abrasives and a more reasonable removal redundancy of fine-grinding and polishing during optical production is given by using abrasives in different-size orderly. 2009 SPIE.
收录类别	EI
内容类型	会议论文
源URL	[http://ir.ciomp.ac.cn/handle/181722/33858]
专题	长春光学精密机械与物理研究所_中科院长春光机所知识产出_会议论文
推荐引用方式 GB/T 7714	Chen X.-P.,Xuan B.,Wang P.,et al. Study on the influence and disposal method of the micro-cracks of optical components (EI CONFERENCE)[C]. 见:4th International Symposium on Advanced Optical Manufacturing and Testing Technologies: Advanced Optical Manufacturing Technologies, November 19, 2008 - November 21, 2008. Chengdu, China.

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