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	Electrospun vein grafts with high cell infiltration for vascular tissue engineering.
	Tan, ZK; Gao, XK; Liu, T; Yang, YK; Zhong, JC; Tong, CY; Tan, YJ
刊名	Mater Sci Eng C Mater Biol Appl
	2017
卷号	Vol.81页码:407-415
关键词	Bilayer Electrospinning Fast vascularization High cell infiltration Vein graft
URL标识	查看原文
公开日期	[db:dc_date_available]
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/6046303
专题	湖南大学
作者单位	Hunan Univ, Coll Biol, Changsha 410082, Hunan, Peoples R China
推荐引用方式 GB/T 7714	Tan, ZK,Gao, XK,Liu, T,et al. Electrospun vein grafts with high cell infiltration for vascular tissue engineering.[J]. Mater Sci Eng C Mater Biol Appl,2017,Vol.81:407-415.
APA	Tan, ZK.,Gao, XK.,Liu, T.,Yang, YK.,Zhong, JC.,...&Tan, YJ.(2017).Electrospun vein grafts with high cell infiltration for vascular tissue engineering..Mater Sci Eng C Mater Biol Appl,Vol.81,407-415.
MLA	Tan, ZK,et al."Electrospun vein grafts with high cell infiltration for vascular tissue engineering.".Mater Sci Eng C Mater Biol Appl Vol.81(2017):407-415.

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