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	Reliability evaluation of logic circuits based on transient faults propagation metrics
	Cai, S; Yu, F; Wang, WZ; Liu, TQ; Liu, P; Wang, W
刊名	IEICE ELECTRONICS EXPRESS
	2017
卷号	Vol.14 No.7
关键词	reliability evaluation soft error TFPM credibility
ISSN号	1349-2543
URL标识	查看原文
公开日期	[db:dc_date_available]
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/6044218
专题	湖南大学
作者单位	1.Changsha Univ Sci & Technol, Hunan Prov Key Lab Intelligent Proc Big Data Tran, Changsha, Hunan, Peoples R China 2.Changsha Univ Sci & Technol, Coll Comp & Commun Engn, Changsha, Hunan, Peoples R China 3.Hangzhou Dianzi Univ, Coll Management, Hangzhou, Zhejiang, Peoples R China 4.Hunan Univ, Coll Informat Sci & Engn, Changsha, Hunan, Peoples R China
推荐引用方式 GB/T 7714	Cai, S,Yu, F,Wang, WZ,et al. Reliability evaluation of logic circuits based on transient faults propagation metrics[J]. IEICE ELECTRONICS EXPRESS,2017,Vol.14 No.7.
APA	Cai, S,Yu, F,Wang, WZ,Liu, TQ,Liu, P,&Wang, W.(2017).Reliability evaluation of logic circuits based on transient faults propagation metrics.IEICE ELECTRONICS EXPRESS,Vol.14 No.7.
MLA	Cai, S,et al."Reliability evaluation of logic circuits based on transient faults propagation metrics".IEICE ELECTRONICS EXPRESS Vol.14 No.7(2017).

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