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	Comparison of subsurface damages on mono-crystalline silicon between traditional nanoscale machining and laser-assisted nanoscale machining via molecular dynamics simulation
	Dai, Houfu; Li, Shaobo; Chen, Genyu
	2018
卷号	414页码:61-67
URL标识	查看原文
WOS记录号	WOS:000423008300008
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/5976758
专题	贵州大学
作者单位	1.[1]Guizhou Univ, Coll Mech Engn, Guiyang 550025, Guizhou, Peoples R China 2.[2]Hunan Univ, State Key Lab Adv Design & Mfg Vehicle Body, Changsha 410082, Hunan, Peoples R China
推荐引用方式 GB/T 7714	Dai, Houfu,Li, Shaobo,Chen, Genyu. Comparison of subsurface damages on mono-crystalline silicon between traditional nanoscale machining and laser-assisted nanoscale machining via molecular dynamics simulation[J],2018,414:61-67.
APA	Dai, Houfu,Li, Shaobo,&Chen, Genyu.(2018).Comparison of subsurface damages on mono-crystalline silicon between traditional nanoscale machining and laser-assisted nanoscale machining via molecular dynamics simulation.,414,61-67.
MLA	Dai, Houfu,et al."Comparison of subsurface damages on mono-crystalline silicon between traditional nanoscale machining and laser-assisted nanoscale machining via molecular dynamics simulation".414(2018):61-67.

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