Thermosiphon: A Thermal Aware NUCA Architecture for Write Energy Reduction of the STT-MRAM based LLCs
Wu, Bi ; Cheng, Yuanqing ; Dai, Pengcheng ; Yang, Jianlei ; Zhang, Youguang ; Liu, Dijun ; Wang, Ying ; Zhao, Weisheng
2017
会议名称 2017 IEEE/ACM INTERNATIONAL CONFERENCE ON COMPUTER-AIDED DESIGN (ICCAD)
会议日期 2017-01-01
关键词 Budget control
Cache memory
Computer aided design
Integrated circuit design
Magnetic leakage
Magnetic recording
Magnetic storage
Thermal management (electronics)
Thermosyphons
Chip multi-processors
Emerging technologies
Hardware overheads
High integration density
Non-uniform cache access
Spin transfer torque
Thermal distributions
Ultra low leakages
MRAM devices
卷号 2017-November
页码 474-481
收录类别 EI
; CPCI-S
URL标识 查看原文
WOS记录号 WOS:000492956200063
内容类型 会议论文
URI标识 http://www.corc.org.cn/handle/1471x/5945210
专题 北京航空航天大学
推荐引用方式 GB/T 7714
Wu, Bi,Cheng, Yuanqing,Dai, Pengcheng,et al. Thermosiphon: A Thermal Aware NUCA Architecture for Write Energy Reduction of the STT-MRAM based LLCs[C]. 见:2017 IEEE/ACM INTERNATIONAL CONFERENCE ON COMPUTER-AIDED DESIGN (ICCAD). 2017-01-01.
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