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Thermosiphon: A Thermal Aware NUCA Architecture for Write Energy Reduction of the STT-MRAM based LLCs
Wu, Bi; Cheng, Yuanqing; Dai, Pengcheng; Yang, Jianlei; Zhang, Youguang; Liu, Dijun; Wang, Ying; Zhao, Weisheng
2017
会议名称2017 IEEE/ACM INTERNATIONAL CONFERENCE ON COMPUTER-AIDED DESIGN (ICCAD)
会议日期2017-01-01
关键词Budget control Cache memory Computer aided design Integrated circuit design Magnetic leakage Magnetic recording Magnetic storage Thermal management (electronics) Thermosyphons Chip multi-processors Emerging technologies Hardware overheads High integration density Non-uniform cache access Spin transfer torque Thermal distributions Ultra low leakages MRAM devices
卷号2017-November
页码474-481
收录类别EI ; CPCI-S
URL标识查看原文
WOS记录号WOS:000492956200063
内容类型会议论文
URI标识http://www.corc.org.cn/handle/1471x/5945210
专题北京航空航天大学
推荐引用方式
GB/T 7714
Wu, Bi,Cheng, Yuanqing,Dai, Pengcheng,et al. Thermosiphon: A Thermal Aware NUCA Architecture for Write Energy Reduction of the STT-MRAM based LLCs[C]. 见:2017 IEEE/ACM INTERNATIONAL CONFERENCE ON COMPUTER-AIDED DESIGN (ICCAD). 2017-01-01.
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