| Photometric and Colorimetric Assessment of LED Chip Scale Packages by Using a Step-Stress Accelerated Degradation Test (SSADT) Method | |
| Qian, Cheng; Fan, Jiajie; Fang, Jiayi; Yu, Chaohua; Ren, Yi; Fan, Xuejun; Zhang, Guoqi | |
| 刊名 | MATERIALS
 |
| 2017 | |
| 卷号 | 10 |
| 关键词 | light-emitting diode chip scale package accelerated aging step stress test reliability qualification |
| ISSN号 | 1996-1944 |
| DOI | 10.3390/ma10101181 |
| URL标识 | 查看原文 |
| 收录类别 | SCIE ; EI |
| WOS记录号 | WOS:000414639000076 |
| 内容类型 | 期刊论文 |
| URI标识 | http://www.corc.org.cn/handle/1471x/5937484 |
| 专题 | 北京航空航天大学 |
| 推荐引用方式 GB/T 7714 | Qian, Cheng,Fan, Jiajie,Fang, Jiayi,et al. Photometric and Colorimetric Assessment of LED Chip Scale Packages by Using a Step-Stress Accelerated Degradation Test (SSADT) Method[J]. MATERIALS,2017,10. |
| APA | Qian, Cheng.,Fan, Jiajie.,Fang, Jiayi.,Yu, Chaohua.,Ren, Yi.,...&Zhang, Guoqi.(2017).Photometric and Colorimetric Assessment of LED Chip Scale Packages by Using a Step-Stress Accelerated Degradation Test (SSADT) Method.MATERIALS,10. |
| MLA | Qian, Cheng,et al."Photometric and Colorimetric Assessment of LED Chip Scale Packages by Using a Step-Stress Accelerated Degradation Test (SSADT) Method".MATERIALS 10(2017). |
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