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	Thermal analysis of epidermal electronic devices integrated with human skin considering the effects of interfacial thermal resistance
	Li, Yuhang; Zhang, Jianpeng; Xing, Yufeng; Song, Jizhou
刊名	AIP ADVANCES
	2018
卷号	8
关键词	Electronic equipment Heat transfer Thermoanalysis Thermoelectric equipment Transfer matrix method Accurate prediction Analytical studies Bonding conditions Imperfect bondings Integrated applications Interfacial thermal resistance Maximum temperature Monitoring of human vital signs Finite element method
ISSN号	2158-3226
DOI	10.1063/1.5029505
URL标识	查看原文
收录类别	SCIE ; EI
WOS记录号	WOS:000433954000033
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/5932554
专题	北京航空航天大学
推荐引用方式 GB/T 7714	Li, Yuhang,Zhang, Jianpeng,Xing, Yufeng,et al. Thermal analysis of epidermal electronic devices integrated with human skin considering the effects of interfacial thermal resistance[J]. AIP ADVANCES,2018,8.
APA	Li, Yuhang,Zhang, Jianpeng,Xing, Yufeng,&Song, Jizhou.(2018).Thermal analysis of epidermal electronic devices integrated with human skin considering the effects of interfacial thermal resistance.AIP ADVANCES,8.
MLA	Li, Yuhang,et al."Thermal analysis of epidermal electronic devices integrated with human skin considering the effects of interfacial thermal resistance".AIP ADVANCES 8(2018).

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