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	Analysis of Open-Hole Compressive CFRP Laminates at Various Temperatures Based on a Multiscale Strategy
	Liu, Zhun; Guan, Zhidong; Tan, Riming; Xu, Jifeng
刊名	APPLIED COMPOSITE MATERIALS
	2019
卷号	26页码:923-944
关键词	Multiscale analysis Open-hole compressive Constituent Temperature Thermal residual stress
ISSN号	0929-189X
DOI	10.1007/s10443-019-9759-8
URL标识	查看原文
收录类别	SCIE ; EI
WOS记录号	WOS:000469442100014
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/5922204
专题	北京航空航天大学
推荐引用方式 GB/T 7714	Liu, Zhun,Guan, Zhidong,Tan, Riming,et al. Analysis of Open-Hole Compressive CFRP Laminates at Various Temperatures Based on a Multiscale Strategy[J]. APPLIED COMPOSITE MATERIALS,2019,26:923-944.
APA	Liu, Zhun,Guan, Zhidong,Tan, Riming,&Xu, Jifeng.(2019).Analysis of Open-Hole Compressive CFRP Laminates at Various Temperatures Based on a Multiscale Strategy.APPLIED COMPOSITE MATERIALS,26,923-944.
MLA	Liu, Zhun,et al."Analysis of Open-Hole Compressive CFRP Laminates at Various Temperatures Based on a Multiscale Strategy".APPLIED COMPOSITE MATERIALS 26(2019):923-944.

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