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	Fatigue lifetime analysis of the electronic packaging structures under the combined thermal stress and vibration loading conditions [热振加载条件下电子封装结构的疲劳寿命分析]
	Zhao, F.; Qiu, Y.; Jia, F.; Ma, H.
刊名	Xi'an Dianzi Keji Daxue Xuebao/Journal of Xidian University
	2019
卷号	46页码:54-60
关键词	Ball grid arrays Chip scale packages Fatigue damage Soldered joints Stress analysis Thermal cycling Thermal stress Vibration analysis Coffin-Manson equation Electronic Packaging Fatigue lifetime Incremental damage superposition approach Plastic ball grid array packages Temperature environments Unified viscoplasticity Vibration loading Thermal fatigue
ISSN号	10012400
DOI	10.19665/j.issn1001-2400.2019.02.010
URL标识	查看原文
收录类别	EI
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/5918828
专题	北京航空航天大学
推荐引用方式 GB/T 7714	Zhao, F.,Qiu, Y.,Jia, F.,等. Fatigue lifetime analysis of the electronic packaging structures under the combined thermal stress and vibration loading conditions [热振加载条件下电子封装结构的疲劳寿命分析][J]. Xi'an Dianzi Keji Daxue Xuebao/Journal of Xidian University,2019,46:54-60.
APA	Zhao, F.,Qiu, Y.,Jia, F.,&Ma, H..(2019).Fatigue lifetime analysis of the electronic packaging structures under the combined thermal stress and vibration loading conditions [热振加载条件下电子封装结构的疲劳寿命分析].Xi'an Dianzi Keji Daxue Xuebao/Journal of Xidian University,46,54-60.
MLA	Zhao, F.,et al."Fatigue lifetime analysis of the electronic packaging structures under the combined thermal stress and vibration loading conditions [热振加载条件下电子封装结构的疲劳寿命分析]".Xi'an Dianzi Keji Daxue Xuebao/Journal of Xidian University 46(2019):54-60.

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