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	Integrated circuit failure analysis and reliability prediction based on physics of failure
	Jiao, Jian; De, Xinlin; Chen, Zhiwei; Zhao, Tingdi
刊名	ENGINEERING FAILURE ANALYSIS
	2019
卷号	104页码:714-726
关键词	Physics of failure Reliability prediction Simulation test Failure analysis Circuit board
ISSN号	1350-6307
DOI	10.1016/j.engfailanal.2019.05.021
URL标识	查看原文
收录类别	SCIE ; EI
WOS记录号	WOS:000484364400059
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/5918618
专题	北京航空航天大学
推荐引用方式 GB/T 7714	Jiao, Jian,De, Xinlin,Chen, Zhiwei,et al. Integrated circuit failure analysis and reliability prediction based on physics of failure[J]. ENGINEERING FAILURE ANALYSIS,2019,104:714-726.
APA	Jiao, Jian,De, Xinlin,Chen, Zhiwei,&Zhao, Tingdi.(2019).Integrated circuit failure analysis and reliability prediction based on physics of failure.ENGINEERING FAILURE ANALYSIS,104,714-726.
MLA	Jiao, Jian,et al."Integrated circuit failure analysis and reliability prediction based on physics of failure".ENGINEERING FAILURE ANALYSIS 104(2019):714-726.

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