In situ tensile creep behaviors of Sn-4Ag/Cu solder joints revealed by electron backscatter diffraction

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	In situ tensile creep behaviors of Sn-4Ag/Cu solder joints revealed by electron backscatter diffraction
	Q. K. Zhang ; Z. F. Zhang
刊名	Scripta Materialia
	2012
卷号	67 期号:3 页码:289-292
关键词	Sn-4Ag solder In situ tensile creep Electron backscatter diffraction (EBSD) Polygonization Grains subdivision sn-ag stress-relaxation fracture-behavior thermal fatigue deformation grain recrystallization microstructure orientation evolution
ISSN号	1359-6462
中文摘要	In this study, the in situ tensile creep behaviors of Sn-4Ag/Cu solder joints were observed, and microstructural evolutions of the solder during the deformation processes were characterized by electron backscatter diffraction. The results reveal that slow plastic deformation or grain rotation occurs inside different solder grains, depending on their orientations and distance from the joint interface. When the strain increases to a certain extent, dynamic recovery occurs inside some solder grains, resulting in polygonization and grain subdivision. (C) 2012 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
原文出处	://WOS:000306256600017
公开日期	2013-02-05
内容类型	期刊论文
源URL	[http://ir.imr.ac.cn/handle/321006/60455]
专题	金属研究所_中国科学院金属研究所
推荐引用方式 GB/T 7714	Q. K. Zhang,Z. F. Zhang. In situ tensile creep behaviors of Sn-4Ag/Cu solder joints revealed by electron backscatter diffraction[J]. Scripta Materialia,2012,67(3):289-292.
APA	Q. K. Zhang,&Z. F. Zhang.(2012).In situ tensile creep behaviors of Sn-4Ag/Cu solder joints revealed by electron backscatter diffraction.Scripta Materialia,67(3),289-292.
MLA	Q. K. Zhang,et al."In situ tensile creep behaviors of Sn-4Ag/Cu solder joints revealed by electron backscatter diffraction".Scripta Materialia 67.3(2012):289-292.