In-situ observation of fracture behavior of Sn-3.0Ag-0.5Cu lead-free solder during three-point bending tests in ESEM

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	In-situ observation of fracture behavior of Sn-3.0Ag-0.5Cu lead-free solder during three-point bending tests in ESEM
	M. N. Wang ; J. Q. Wang ; H. Feng ; W. Ke
刊名	Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing
	2012
卷号	558 页码:649-655
关键词	Lead-free solder Microstructure Corrosion Three-point bending Fracture electrochemical corrosion behavior 3.5-percent nacl solution ga solder alloys sn joints
ISSN号	0921-5093
中文摘要	The effect of microstructure and corrosion on fracture behavior of Sn-3.0Ag-0.5Cu (SAC305) solder alloy was in-situ studied at three-point bending test using environmental scanning electron microscopy (ESEM). The results showed that the microcracks initiated at the Sn boundaries in the beta-Sn region for commercial SAC305 solder. For furnace-cooled SAC305 solder, cracks preferred to initiating and propagating along Sn boundaries and Sn/Ag3Sn interface. Ag3Sn plates were easily broken during the bending test. The fracture behavior was significantly affected by corrosion. The most vulnerable area to fracture is the corroded region of the specimen. (C) 2012 Elsevier B.V. All rights reserved.
原文出处	://WOS:000311249800088
公开日期	2013-02-05
内容类型	期刊论文
源URL	[http://ir.imr.ac.cn/handle/321006/60297]
专题	金属研究所_中国科学院金属研究所
推荐引用方式 GB/T 7714	M. N. Wang,J. Q. Wang,H. Feng,et al. In-situ observation of fracture behavior of Sn-3.0Ag-0.5Cu lead-free solder during three-point bending tests in ESEM[J]. Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing,2012,558:649-655.
APA	M. N. Wang,J. Q. Wang,H. Feng,&W. Ke.(2012).In-situ observation of fracture behavior of Sn-3.0Ag-0.5Cu lead-free solder during three-point bending tests in ESEM.Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing,558,649-655.
MLA	M. N. Wang,et al."In-situ observation of fracture behavior of Sn-3.0Ag-0.5Cu lead-free solder during three-point bending tests in ESEM".Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing 558(2012):649-655.