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	Multi-layered high density connections
	HALL, RICHARD RONALD; LIN, HOW TZU; MAJKA, CHRISTOPHER JOHN; SEASTRAND, NORMAN COREY; SEWARD, MATTHEW FRANCIS; SMITH, RONALD VERNE
	2004-04-13
著作权人	GOOGLE LLC
专利号	US6721187
国家	美国
文献子类	授权发明
其他题名	Multi-layered high density connections
英文摘要	A multi-layer electronic structure includes an increased capacity for the attachment of active or passive devices thereto. This is achieved by creating a three-dimensional grid of connection points to electrically couple active or passive surface mounted devices to edge mounted devices. The grid pattern is useful with any laminate including circuit cards, ceramic modules and flexible circuits. The variety of electrical devices that may be connected to the cross-sectional substrate includes, but is not limited to, chips such as semiconductor chips, diodes, resistors, capacitors and printed wiring boards. The structure can be used to more rapidly pass data, such as optical data that is transmitted from a spectroscope through a VCSEL laser and the electronic structure to a computer for diagnostics and analysis. A stepped arrangement of circuitized laminates is described for this purpose.
公开日期	2004-04-13
申请日期	2001-03-16
状态	失效
内容类型	专利
源URL	[http://ir.opt.ac.cn/handle/181661/41240]
专题	半导体激光器专利数据库
作者单位	GOOGLE LLC
推荐引用方式 GB/T 7714	HALL, RICHARD RONALD,LIN, HOW TZU,MAJKA, CHRISTOPHER JOHN,et al. Multi-layered high density connections. US6721187. 2004-04-13.

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