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	Single level microelectronic device package with an integral window
	PETERSON, KENNETH A.; WATSON, ROBERT D.
	2003-12-09
著作权人	SANDIA CORPORATION
专利号	US6661084
国家	美国
文献子类	授权发明
其他题名	Single level microelectronic device package with an integral window
英文摘要	A package with an integral window for housing a microelectronic device. The integral window is bonded directly to the package without having a separate layer of adhesive material disposed in-between the window and the package. The device can be a semiconductor chip, CCD chip, CMOS chip, VCSEL chip, laser diode, MEMS device, or IMEMS device. The package can be formed of a multilayered LTCC or HTCC cofired ceramic material, with the integral window being simultaneously joined to the package during cofiring. The microelectronic device can be flip-chip interconnected so that the light-sensitive side is optically accessible through the window. A glob-top encapsulant or protective cover can be used to protect the microelectronic device and electrical interconnections. The result is a compact, low profile package having an integral window that is hermetically sealed to the package prior to mounting and interconnecting the microelectronic device.
公开日期	2003-12-09
申请日期	2002-02-25
状态	授权
内容类型	专利
源URL	[http://ir.opt.ac.cn/handle/181661/40001]
专题	半导体激光器专利数据库
作者单位	SANDIA CORPORATION
推荐引用方式 GB/T 7714	PETERSON, KENNETH A.,WATSON, ROBERT D.. Single level microelectronic device package with an integral window. US6661084. 2003-12-09.

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