Micro-transfer-printable flip-chip structures and methods | |
BOWER, CHRISTOPHER; MEITL, MATTHEW; TRINDADE, ANTÓNIO JOSÉ MARQUES; COK, RONALD S.; RAYMOND, BROOK; PREVATTE, CARL | |
2019-08-27 | |
著作权人 | X-CELEPRINT LIMITED |
专利号 | US10395966 |
国家 | 美国 |
文献子类 | 授权发明 |
其他题名 | Micro-transfer-printable flip-chip structures and methods |
英文摘要 | In certain embodiments, a method of making a semiconductor structure suitable for transfer printing (e.g., micro-transfer printing) includes providing a support substrate and disposing and processing one or more semiconductor layers on the support substrate to make a completed semiconductor device. A patterned release layer and, optionally, a capping layer are disposed on or over the completed semiconductor device and the patterned release layer or capping layer, if present, are bonded to a handle substrate with a bonding layer. The support substrate is removed to expose the completed semiconductor device and, in some embodiments, a portion of the patterned release layer. In some embodiments, an entry path is formed to expose a portion of the patterned release layer. In some embodiments, the release layer is etched and the completed semiconductor devices transfer printed (e.g., micro-transfer printed) from the handle substrate to a destination substrate. |
公开日期 | 2019-08-27 |
申请日期 | 2018-04-03 |
状态 | 授权 |
内容类型 | 专利 |
源URL | [http://ir.opt.ac.cn/handle/181661/38082] |
专题 | 半导体激光器专利数据库 |
作者单位 | X-CELEPRINT LIMITED |
推荐引用方式 GB/T 7714 | BOWER, CHRISTOPHER,MEITL, MATTHEW,TRINDADE, ANTÓNIO JOSÉ MARQUES,et al. Micro-transfer-printable flip-chip structures and methods. US10395966. 2019-08-27. |
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