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	Photonic transceiving device package structure
	NAGARAJAN, RADHAKRISHNAN L.; LI, PENG-CHIH; KATO, MASAKI; TOGAMI, CHRIS
	2017-06-06
著作权人	INPHI CORPORATION
专利号	US9671580
国家	美国
文献子类	授权发明
其他题名	Photonic transceiving device package structure
英文摘要	An apparatus for packaging a photonic transceiver. The apparatus includes a case having a base member, two partial side members, and a lid member to provide a spatial volume with an opening at a back end of the base member. Additionally, the apparatus includes a PCB installed inside the spatial volume over the base member with a pluggable connector at the back end. The apparatus includes one or more optical transmitting devices being mounted upside-down via a flex circuit board bended 180 degrees inward to a backside of the PCB and including a built-in TEC module in contact with the lid member. Furthermore, the apparatus includes a silicon photonics chip including a fiber-to-silicon attachment module, mounted on the PCB and coupled to a modulation driver module and a trans-impedance-amplifier module. Moreover, the apparatus includes an optical input port and output port being back connected to the fiber-to-silicon attachment module.
公开日期	2017-06-06
申请日期	2016-03-18
状态	授权
内容类型	专利
源URL	[http://ir.opt.ac.cn/handle/181661/37880]
专题	半导体激光器专利数据库
作者单位	INPHI CORPORATION
推荐引用方式 GB/T 7714	NAGARAJAN, RADHAKRISHNAN L.,LI, PENG-CHIH,KATO, MASAKI,et al. Photonic transceiving device package structure. US9671580. 2017-06-06.

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