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	Curable resin composition and cured product thereof, encapsulant, and semiconductor device
	KAMURO, SHIGEAKI; NAKAGAWA, YASUNOBU
	2017-05-09
著作权人	DAICEL CORPORATION
专利号	US9644098
国家	美国
文献子类	授权发明
其他题名	Curable resin composition and cured product thereof, encapsulant, and semiconductor device
英文摘要	Provided is a curable resin composition capable of forming a cured product that has excellent heat resistance and transparency and, in particular, offers excellent barrier properties to a corrosive gas. The curable resin composition according to the present invention includes a polyorganosiloxane (A), an isocyanurate compound (B), and a silane coupling agent (C). The polyorganosiloxane (A) is an aryl-containing polyorganosiloxane. The polyorganosiloxane (A) preferably includes a polyorganosiloxane having a number-average molecular weight (Mn) of 500 to 4000 as determined by gel permeation chromatography and calibrated with a polystyrene standard.
公开日期	2017-05-09
申请日期	2015-08-27
状态	授权
内容类型	专利
源URL	[http://ir.opt.ac.cn/handle/181661/37836]
专题	半导体激光器专利数据库
作者单位	DAICEL CORPORATION
推荐引用方式 GB/T 7714	KAMURO, SHIGEAKI,NAKAGAWA, YASUNOBU. Curable resin composition and cured product thereof, encapsulant, and semiconductor device. US9644098. 2017-05-09.

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