| Light-emitting diodes on a wafer-level package | |
| WEIGERT, MARTIN | |
| 2015-09-22 | |
| 著作权人 | AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED |
| 专利号 | US9142746 |
| 国家 | 美国 |
| 文献子类 | 授权发明 |
| 其他题名 | Light-emitting diodes on a wafer-level package |
| 英文摘要 | A light emitter and methods of constructing the same is disclosed. The light emitter is disclosed as including a jumper chip and one or more light sources, such as Light Emitting Diodes (LEDs). The light sources are connected to the jumper chip via conductive traces manufactured with semiconductor processing techniques. The jumper chip is disclosed as having a plurality of isolated conductive vias, thereby allowing the jumper chip to present multiple different bonding areas that are electrically isolated from one another. |
| 公开日期 | 2015-09-22 |
| 申请日期 | 2013-11-11 |
| 状态 | 授权 |
| 内容类型 | 专利 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/37703]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED |
| 推荐引用方式 GB/T 7714 | WEIGERT, MARTIN. Light-emitting diodes on a wafer-level package. US9142746. 2015-09-22. |
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