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	Light emitting element, a light emitting device, a method of manufacturing a light emitting element and a method of manufacturing a light emitting device
	KIM, YU-SIK; PARK, SANG-JOON
	2012-12-25
著作权人	SAMSUNG ELECTRONICS CO., LTD.
专利号	US8338204
国家	美国
文献子类	授权发明
其他题名	Light emitting element, a light emitting device, a method of manufacturing a light emitting element and a method of manufacturing a light emitting device
英文摘要	The present invention provides a light-emitting element, a method of manufacturing the light-emitting element, a light-emitting device, and a method of manufacturing the light-emitting device. A method of manufacturing a light-emitting element includes: forming a first conductive layer of a first conductive type, a light-emitting layer, and a second conductive layer of a second conductive type on at least one first substrate, forming an ohmic layer on the second conductive layer and bonding the at least one first substrate to a second substrate. The second substrate being larger than the first substrate. The method further includes etching portions of the ohmic layer, the second conductive layer, and the light-emitting layer to expose a portion of the first conductive layer.
公开日期	2012-12-25
申请日期	2011-10-24
状态	授权
内容类型	专利
源URL	[http://ir.opt.ac.cn/handle/181661/37555]
专题	半导体激光器专利数据库
作者单位	SAMSUNG ELECTRONICS CO., LTD.
推荐引用方式 GB/T 7714	KIM, YU-SIK,PARK, SANG-JOON. Light emitting element, a light emitting device, a method of manufacturing a light emitting element and a method of manufacturing a light emitting device. US8338204. 2012-12-25.

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