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	Dicing die bond film and method of manufacturing semiconductor device
	TANAKA, SHUMPEI; MATSUMURA, TAKESHI
	2015-09-22
著作权人	NITTO DENKO CORPORATION
专利号	US9142457
国家	美国
文献子类	授权发明
其他题名	Dicing die bond film and method of manufacturing semiconductor device
英文摘要	The present invention provides a dicing die bond film in which yielding and breaking of the dicing film are prevented and in which the die bond film can be suitably broken with a tensile force. In the dicing die bond film of the present invention, the tensile strength of the contact part in which the outer circumference of the push-up jig contacts the dicing film at 25° C. is 15 N or more and 80 N or less and the yield point elongation is 80% or more, the tensile strength of the wafer bonding part of the dicing film at 25° C. is 10 N or more and 70 N or less and the yield point elongation is 30% or more, [(the tensile strength of the contact part)−(the tensile strength of the wafer bonding part)] is 0 N or more and 60 N or less, and the breaking elongation rate of the die bond film at 25° C. is more than 40% and 500% or less.
公开日期	2015-09-22
申请日期	2011-09-21
状态	失效
内容类型	专利
源URL	[http://ir.opt.ac.cn/handle/181661/37546]
专题	半导体激光器专利数据库
作者单位	NITTO DENKO CORPORATION
推荐引用方式 GB/T 7714	TANAKA, SHUMPEI,MATSUMURA, TAKESHI. Dicing die bond film and method of manufacturing semiconductor device. US9142457. 2015-09-22.

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