| Substrate for device bonding and method for manufacturing same | |
| YOKOYAMA, HIROKI | |
| 2009-12-01 | |
| 著作权人 | TOKUYAMA CORPORATION |
| 专利号 | US7626264 |
| 国家 | 美国 |
| 文献子类 | 授权发明 |
| 其他题名 | Substrate for device bonding and method for manufacturing same |
| 英文摘要 | A substrate for device bonding is provided, which enables bonding of a device with high bond strength to an Au electrode formed on a substrate such as aluminum nitride by soldering the device at a low temperature using a soft solder metal having a low melting point such as an Au—Sn-based solder having an Au content of 10% by weight. The substrate for device bonding comprises a substrate having an Au electrode layer formed on its surface and in which (i) a layer composed of a platinum group element, (ii) a layer composed of at least one transition metal element selected from the group consisting of Ti, V, Cr and Co, (iii) a barrier metal layer composed of at least one metal selected from the group consisting of Ag, Cu and Ni and (iv) a solder layer composed of a solder containing Sn or In as a main component are laminated in this order on the Au electrode layer. |
| 公开日期 | 2009-12-01 |
| 申请日期 | 2005-03-24 |
| 状态 | 失效 |
| 内容类型 | 专利 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/37136]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | TOKUYAMA CORPORATION |
| 推荐引用方式 GB/T 7714 | YOKOYAMA, HIROKI. Substrate for device bonding and method for manufacturing same. US7626264. 2009-12-01. |
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