| Package assembly for electronic device | |
| YU-TUNG, HUANG; CHIH-HSYONG, WU; YUNG-CHENG, HSU | |
| 2007-07-03 | |
| 著作权人 | TAI-SAW TECHNOLOGY CO., LTD. |
| 专利号 | US7239023 |
| 国家 | 美国 |
| 文献子类 | 授权发明 |
| 其他题名 | Package assembly for electronic device |
| 英文摘要 | A buffer layer is formed on a substrate and then electronic devices are packed on the buffer layer in the present invention, and problems of lower hermeticity and complex process in the conventional arts can be avoided. Therefore, the present invention provides a packaging structure and method with a better hermeticity and a simpler process. Especially, due to the buffer layer, the planarization for flip-chip bonding can be improved and reduce negative effects of the packing process. |
| 公开日期 | 2007-07-03 |
| 申请日期 | 2003-09-24 |
| 状态 | 授权 |
| 内容类型 | 专利 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/37008]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | TAI-SAW TECHNOLOGY CO., LTD. |
| 推荐引用方式 GB/T 7714 | YU-TUNG, HUANG,CHIH-HSYONG, WU,YUNG-CHENG, HSU. Package assembly for electronic device. US7239023. 2007-07-03. |
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