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	Flexible interconnect structures for electrical devices and light sources incorporating the same
	BECKER, CHARLES ADRIAN; WEAVER, STANTON EARL; STECHER, THOMAS ELLIOT
	2007-09-25
著作权人	GENERAL ELECTRIC COMPANY
专利号	US7273987
国家	美国
文献子类	授权发明
其他题名	Flexible interconnect structures for electrical devices and light sources incorporating the same
英文摘要	A flexible interconnect structure allows for rapid dissipation of heat generated from an electrical device that includes light-emitting elements, such as light-emitting diodes (“LEDs”) and/or laser diodes. The flexible interconnect structure comprises: (1) at least one flexible dielectric film on which circuit traces and, optionally, electrical circuit components are formed and at least a portion of which is removed through its thickness; and (2) at least a heat sink attached to one surface of the flexible dielectric film opposite to the surface on which circuit traces are formed. The flexible interconnect structure can include a plurality of such flexible dielectric films, each supporting circuit traces and/or circuit components, and each being attached to another by an electrically insulating layer. Electrical devices or light sources having complex shapes are formed from such flexible interconnect structures and light-emitting elements attached to the heat sinks so to be in thermal contact therewith.
公开日期	2007-09-25
申请日期	2002-03-21
状态	失效
内容类型	专利
源URL	[http://ir.opt.ac.cn/handle/181661/36855]
专题	半导体激光器专利数据库
作者单位	GENERAL ELECTRIC COMPANY
推荐引用方式 GB/T 7714	BECKER, CHARLES ADRIAN,WEAVER, STANTON EARL,STECHER, THOMAS ELLIOT. Flexible interconnect structures for electrical devices and light sources incorporating the same. US7273987. 2007-09-25.

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