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	Permanent metallic bonding method
	BACON, DONLAD D.; KATZ, AVISHAY; LEE, CHIEN-HSUN; TAI, KING L.; WONG, YIU-MAN
	1993-08-10
著作权人	AGERE SYSTEMS INC.
专利号	US5234153
国家	美国
文献子类	授权发明
其他题名	Permanent metallic bonding method
英文摘要	A laser device is bonded to a diamond submount (20) by means of a procedure including (1) codepositing an auxiliary layer (22), on a layer of barrier metal (21) that has been deposited overlying the submount, followed by (2) depositing a wetting layer (23) on the auxiliary layer, and (3) by depositing a solder layer (24) comprising alternating metallic layers, preferably of gold and tin sufficient to form an overall tin-rich gold-tin eutectic composition. The barrier metal is typically W, Mo, Cr, or Ru. Prior to bonding, a conventional metallization such as Ti-Pt-Au (three layers) is deposited on the laser device's bottom ohmic contact, typically comprising Ge. Then, during bonding, the solder layer is brought into physical contact with the laser device's metallization under enough heat and pressure, followed by cooling, to form a permanent joint between them. The thickness of the solder layer is advantageously less than approximately 5 mu m. The wetting layer is preferably the intermetallic compound Ni3Sn4, and the auxiliary layer is formed by codepositing the metallic components of this intermetallic together with the barrier metal.
公开日期	1993-08-10
申请日期	1992-08-28
状态	失效
内容类型	专利
源URL	[http://ir.opt.ac.cn/handle/181661/36104]
专题	半导体激光器专利数据库
作者单位	AGERE SYSTEMS INC.
推荐引用方式 GB/T 7714	BACON, DONLAD D.,KATZ, AVISHAY,LEE, CHIEN-HSUN,et al. Permanent metallic bonding method. US5234153. 1993-08-10.

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