Semiconductor modification process for conductive and modified electrical regions and related structures
BONAR, JAMES RONALD; VALENTINE, GARETH; GORTON, STEPHEN WARREN; GONG, ZHENG; SMALL, JAMES
2019-02-19
著作权人FACEBOOK TECHNOLOGIES, LLC
专利号US10211371
国家美国
文献子类授权发明
其他题名Semiconductor modification process for conductive and modified electrical regions and related structures
英文摘要There is herein described a process for providing improved device performance and fabrication techniques for semiconductors. More particularly, the present invention relates to a process for forming features, such as pixels, on GaN semiconductors using a p-GaN modification and annealing process. The process also relates to a plasma and thermal anneal process which results in a p-GaN modified layer where the annealing simultaneously enables the formation of conductive p-GaN and modified p-GaN regions that behave in an n-like manner and block vertical current flow. The process also extends to Resonant-Cavity Light Emitting Diodes (RCLEDs), pixels with a variety of sizes and electrically insulating planar layer for electrical tracks and bond pads.
公开日期2019-02-19
申请日期2015-02-13
状态授权
内容类型专利
源URL[http://ir.opt.ac.cn/handle/181661/35655]  
专题半导体激光器专利数据库
作者单位FACEBOOK TECHNOLOGIES, LLC
推荐引用方式
GB/T 7714
BONAR, JAMES RONALD,VALENTINE, GARETH,GORTON, STEPHEN WARREN,et al. Semiconductor modification process for conductive and modified electrical regions and related structures. US10211371. 2019-02-19.
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