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	Method for reducing thermal loss and providing mechanical compliance in a semiconductor package and the semiconductor package formed therefrom
	DAUTARTAS, MINDAUGAS F.; FREUND, JOSEPH M.; GEARY, JOHN M.; PRYZBYLEK, GEORGE J.
	2003-04-15
著作权人	LUCENT TECHNOLOGIES, INC.
专利号	US6549550
国家	美国
文献子类	授权发明
其他题名	Method for reducing thermal loss and providing mechanical compliance in a semiconductor package and the semiconductor package formed therefrom
英文摘要	Flexible ground connectors are adapted to withstand temperature-induced stresses. The connectors may be formed of low thermal conductivity materials. The connectors may be used within a semiconductor package that also encloses a thermoelectric cooling device, a conductive submount, and a semiconductor light source. The submount may be grounded to the package wall by locating a pair of the flexible ground connectors across a gap to a ledge in the wall. The ground connectors may be formed of stainless steel, and they may be gold plated for improved electrical conductivity.
公开日期	2003-04-15
申请日期	2001-02-14
状态	授权
内容类型	专利
源URL	[http://ir.opt.ac.cn/handle/181661/35391]
专题	半导体激光器专利数据库
作者单位	LUCENT TECHNOLOGIES, INC.
推荐引用方式 GB/T 7714	DAUTARTAS, MINDAUGAS F.,FREUND, JOSEPH M.,GEARY, JOHN M.,et al. Method for reducing thermal loss and providing mechanical compliance in a semiconductor package and the semiconductor package formed therefrom. US6549550. 2003-04-15.

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