Structure and method for separation and transfer of semiconductor thin films onto dissimilar substrate materials
WONG, WILLIAM S.; KNEISSL, MICHAEL A.
2003-05-13
著作权人EPISTAR CORPORATION
专利号US6562648
国家美国
文献子类授权发明
其他题名Structure and method for separation and transfer of semiconductor thin films onto dissimilar substrate materials
英文摘要A method for placing nitride laser diode arrays on a thermally and electrically conducting substrate is described. The method uses an excimer laser to detach the nitride laser diode from the sapphire growth substrate after an intermediate substrate has been attached to the side opposite the sapphire substrate. A secondary layer is subsequently deposited to act as a transfer support structure and bonding interface. The membrane is released from the intermediate substrate and a thermally conducting substrate is subsequently bonded to the side where the sapphire substrate was removed. Similarly, the secondary layer may be used as the new host substrate given an appropriate thickness is deposited prior to removal of the intermediate substrate.
公开日期2003-05-13
申请日期2000-08-23
状态授权
内容类型专利
源URL[http://ir.opt.ac.cn/handle/181661/35364]  
专题半导体激光器专利数据库
作者单位EPISTAR CORPORATION
推荐引用方式
GB/T 7714
WONG, WILLIAM S.,KNEISSL, MICHAEL A.. Structure and method for separation and transfer of semiconductor thin films onto dissimilar substrate materials. US6562648. 2003-05-13.
个性服务
查看访问统计
相关权益政策
暂无数据
收藏/分享
所有评论 (0)
暂无评论
 

除非特别说明,本系统中所有内容都受版权保护,并保留所有权利。


©版权所有 ©2017 CSpace - Powered by CSpace