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	半導体装置とその製造方法
	坂本 安広; 綾部 正昭
	1995-07-31
著作权人	ソニー株式会社
专利号	JP1995070778B2
国家	日本
文献子类	授权发明
其他题名	半導体装置とその製造方法
英文摘要	PURPOSE:To enable bonding by simple and accurate positioning by a method wherein the titled device has layers of high thermal conductive materials which align with each other with the same shape to the mount surface of a semiconductor chip and to the mount surface of a substrate, at least one of which layers is made as the adhesive. CONSTITUTION:A metallic layer 6 of good wetting is formed on the laser diode chip mount region 3 of a semiconductor substrate 1; further, a solder layer 7 is formed on the metallic layer 6. A laser diode chip 8 has a metallic layer 10 formed on the main surface closer to an active layer 9. Besides, a solder layer 11 is formed on the metallic layer 10, and the shape of the former is the same as those of the metallic layer 6 and the solder layer 7 so as to superpose on each other. At the time of mounting a semiconductor chip on the substrate, even without strict positioning to be previously performed, at least one of the layers of high thermal conductive material formed on the semiconductor chip and the substrate melts on heating; and, because of mutual alignment by surface tension, the semiconductor chip is automatically positioned to the substrate with accuracy.
公开日期	1995-07-31
申请日期	1984-10-09
状态	失效
内容类型	专利
源URL	[http://ir.opt.ac.cn/handle/181661/34764]
专题	半导体激光器专利数据库
作者单位	ソニー株式会社
推荐引用方式 GB/T 7714	坂本 安広,綾部 正昭. 半導体装置とその製造方法. JP1995070778B2. 1995-07-31.

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