| Etching method and bevel etching apparatus | |
| KONDO, MASAKI | |
| 2017-04-18 | |
| 著作权人 | TOKYO ELECTRON LIMITED |
| 专利号 | US9623516 |
| 国家 | 美国 |
| 文献子类 | 授权发明 |
| 其他题名 | Etching method and bevel etching apparatus |
| 英文摘要 | An etching method using a bevel etching apparatus is provided. The bevel etching apparatus is configured to etch a substrate by emitting a laser beam and includes a laser generator and a power meter configured to measure the laser beam output from the laser generator. In the method, the power meter is irradiated with the laser beam for a predetermined period of time before etching the substrate by irradiating the substrate with the laser beam. An output value of the laser beam is measured by the power meter. It is determined whether the measured output value of the laser beam is in a range of predetermined thresholds with respect to an output setting value of the laser beam output from the laser generator. |
| 公开日期 | 2017-04-18 |
| 申请日期 | 2015-06-03 |
| 状态 | 授权 |
| 内容类型 | 专利 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/34533]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | TOKYO ELECTRON LIMITED |
| 推荐引用方式 GB/T 7714 | KONDO, MASAKI. Etching method and bevel etching apparatus. US9623516. 2017-04-18. |
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