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	Copackaging of ASIC and silicon photonics
	BYRD, GERALD COIS; NELSON, DAVID ARLO; MESSIAN, JAVID; SCHRANS, THOMAS PIERRE
	2019-07-30
著作权人	ROCKLEY PHOTONICS LIMITED
专利号	US10365436
国家	美国
文献子类	授权发明
其他题名	Copackaging of ASIC and silicon photonics
英文摘要	A system and method for packing optical and electronic components. A module includes an electronic integrated circuit and a plurality of photonic integrated circuits, connected to the electronic integrated circuit by wire bonds or by wire bonds and other conductors. A metal cover of the module is in thermal contact with the electronic integrated circuit and facilitates extraction of heat from the electronic integrated circuit. Arrays of optical fibers are connected to the photonic integrated circuits.
公开日期	2019-07-30
申请日期	2018-01-04
状态	授权
内容类型	专利
源URL	[http://ir.opt.ac.cn/handle/181661/34372]
专题	半导体激光器专利数据库
作者单位	ROCKLEY PHOTONICS LIMITED
推荐引用方式 GB/T 7714	BYRD, GERALD COIS,NELSON, DAVID ARLO,MESSIAN, JAVID,et al. Copackaging of ASIC and silicon photonics. US10365436. 2019-07-30.

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