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	Electronic component mounting package and electronic apparatus using the same
	TANIGUCHI, MASAHIKO
	2016-03-01
著作权人	KYOCERA CORPORATION
专利号	US9273914
国家	美国
文献子类	授权发明
其他题名	Electronic component mounting package and electronic apparatus using the same
英文摘要	An electronic component mounting package includes a first base including an upper surface and a first through-hole vertically formed; a second base having a second through-hole arranged to be overlapped with the first through-hole in a plan view; a sealing material filling the second through-hole; and a signal terminal that is fixed to the second base to pass through the sealing material and has an upper end portion that protrudes upwardly from the upper surface of the first base. The first base includes a plurality of first metal members and a second metal member, and the second metal member is vertically interposed between the plurality of first metal members. A thermal expansion coefficient of the first metal members is larger than a thermal expansion coefficient of the second base. A thermal conductivity of the second metal member is higher than a thermal conductivity of the first metal members.
公开日期	2016-03-01
申请日期	2011-11-29
状态	授权
内容类型	专利
源URL	[http://ir.opt.ac.cn/handle/181661/34101]
专题	半导体激光器专利数据库
作者单位	KYOCERA CORPORATION
推荐引用方式 GB/T 7714	TANIGUCHI, MASAHIKO. Electronic component mounting package and electronic apparatus using the same. US9273914. 2016-03-01.

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