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	Semiconductor light emitting chip and method for processing substrate
	HIRAIWA, DAISUKE; OKABE, TAKEHIKO
	2014-09-16
著作权人	TOYODA GOSEI CO., LTD.
专利号	US8836086
国家	美国
文献子类	授权发明
其他题名	Semiconductor light emitting chip and method for processing substrate
英文摘要	Disclosed is a semiconductor light emitting chip (20) that is composed of: a substrate (10), which has the C plane of a sapphire single crystal as the front surface, and the side surfaces (25, 26) configured of planes that intersect all the planes equivalent to the M plane of the sapphire single crystal, and which includes modified regions (23, 24) in the side surfaces (25, 26), the modified regions being formed by laser radiation; and a light emitting element (12), which is provided on the substrate front surface (10a) of the substrate (10). In the semiconductor light emitting chip, a tilt of the substrate side surfaces with respect to the substrate front surface is suppressed. Also disclosed is a method for processing the substrate.
公开日期	2014-09-16
申请日期	2011-02-16
状态	授权
内容类型	专利
源URL	[http://ir.opt.ac.cn/handle/181661/34078]
专题	半导体激光器专利数据库
作者单位	TOYODA GOSEI CO., LTD.
推荐引用方式 GB/T 7714	HIRAIWA, DAISUKE,OKABE, TAKEHIKO. Semiconductor light emitting chip and method for processing substrate. US8836086. 2014-09-16.

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