Water removing method, optical fiber soldering method, and semiconductor laser module manufacturing method
SAKAMOTO, AKIRA
2016-10-04
著作权人FUJIKURA LTD.
专利号US9457415
国家美国
文献子类授权发明
其他题名Water removing method, optical fiber soldering method, and semiconductor laser module manufacturing method
英文摘要A moisture removing method disclosed removes moisture contained in a dielectric film provided on one end surface of an optical fiber. This moisture removing method causes near infrared light to enter the optical fiber through the other end surface to heat moisture in the dielectric film with use of the near infrared light.
公开日期2016-10-04
申请日期2014-09-05
状态授权
内容类型专利
源URL[http://ir.opt.ac.cn/handle/181661/33069]  
专题半导体激光器专利数据库
作者单位FUJIKURA LTD.
推荐引用方式
GB/T 7714
SAKAMOTO, AKIRA. Water removing method, optical fiber soldering method, and semiconductor laser module manufacturing method. US9457415. 2016-10-04.
个性服务
查看访问统计
相关权益政策
暂无数据
收藏/分享
所有评论 (0)
暂无评论
 

除非特别说明,本系统中所有内容都受版权保护,并保留所有权利。


©版权所有 ©2017 CSpace - Powered by CSpace