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	Stepped optical bridge for connecting semiconductor waveguides
	LAMBERT, DAMIEN
	2019-03-19
著作权人	SKORPIOS TECHNOLOGIES, INC.
专利号	US10234626
国家	美国
文献子类	授权发明
其他题名	Stepped optical bridge for connecting semiconductor waveguides
英文摘要	A photonic device includes a semiconductor wafer having a waveguide formed therein. An end of the waveguide includes a step. The photonic device further includes a semiconductor chip bonded to the semiconductor wafer and having an active region, and a waveguide coupler disposed in a gap between a sidewall of the semiconductor chip and the end of the waveguide. The waveguide coupler includes an optical bridge that has a first end and a second end opposing the first end. The first end of the optical bridge is interfaced with a facet of the active region of the semiconductor chip. The second end of the optical bridge is interfaced with the end of waveguide, and has a portion thereof disposed over the step at the end of the waveguide.
公开日期	2019-03-19
申请日期	2017-02-07
状态	授权
内容类型	专利
源URL	[http://ir.opt.ac.cn/handle/181661/32336]
专题	半导体激光器专利数据库
作者单位	SKORPIOS TECHNOLOGIES, INC.
推荐引用方式 GB/T 7714	LAMBERT, DAMIEN. Stepped optical bridge for connecting semiconductor waveguides. US10234626. 2019-03-19.

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