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	Effects of temperature and strain rate on mechanical behavior of low-silver lead-free solder under drop impact
	Niu, Xiao-Yan[1]; Li, Wei[2]; Wang, Gui-Xiang[3]; Shu, Xue-Feng[4]
刊名	JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
	2015
卷号	26期号:1页码:601-607
ISSN号	0957-4522
DOI	http://dx.doi.org/10.1007/s10854-014-2441-x
URL标识	查看原文
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/5072545
专题	河北大学
作者单位	1.[1]Hebei Univ, Coll Civil Engn & Architecture, Baoding 071002, Peoples R China. 2.[2]Hebei Univ, Coll Civil Engn & Architecture, Baoding 071002, Peoples R China. 3.[3]Hebei Univ, Coll Civil Engn & Architecture, Baoding 071002, Peoples R China. 4.[4]Taiyuan Univ Technol, Inst Appl Mech & Biomed Engn, Taiyuan 030024, Peoples R China.
推荐引用方式 GB/T 7714	Niu, Xiao-Yan[1],Li, Wei[2],Wang, Gui-Xiang[3],et al. Effects of temperature and strain rate on mechanical behavior of low-silver lead-free solder under drop impact[J]. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2015,26(1):601-607.
APA	Niu, Xiao-Yan[1],Li, Wei[2],Wang, Gui-Xiang[3],&Shu, Xue-Feng[4].(2015).Effects of temperature and strain rate on mechanical behavior of low-silver lead-free solder under drop impact.JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,26(1),601-607.
MLA	Niu, Xiao-Yan[1],et al."Effects of temperature and strain rate on mechanical behavior of low-silver lead-free solder under drop impact".JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS 26.1(2015):601-607.

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