| Analytical model for 3D IC temperature considering lateral heat conduction | |
| Wang, Fengjuan; Yu, Ningmei | |
| 2018 | |
| 会议名称 | 2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2017 |
| 会议日期 | 2017-12-14 |
| 会议地点 | Haining, Zhejiang, China |
| 页码 | 1-3 |
| URL标识 | 查看原文 |
| 内容类型 | 会议论文 |
| URI标识 | http://www.corc.org.cn/handle/1471x/4972844 |
| 专题 | 西安理工大学 |
| 推荐引用方式 GB/T 7714 | Wang, Fengjuan,Yu, Ningmei. Analytical model for 3D IC temperature considering lateral heat conduction[C]. 见:2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2017. Haining, Zhejiang, China. 2017-12-14. |
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