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	Copper-nickel-molybdenum alloy film comprises solid-solution nickel and diffusion-barrier molybdenum doped in copper film, with molybdenum showing positive mixing enthalpy to copper and negative mixing enthalpy to nickel.
	LI X ZHANG X ZHU J WANG Q DONG C
	2012
公开日期	2012-04-19
URL标识	查看原文
申请日期	2010-10-13
内容类型	专利
URI标识	http://www.corc.org.cn/handle/1471x/4814203
专题	大连理工大学
作者单位	UNIV DALIAN TECHNOLOGY (UYDA-C
推荐引用方式 GB/T 7714	LI X ZHANG X ZHU J WANG Q DONG C. Copper-nickel-molybdenum alloy film comprises solid-solution nickel and diffusion-barrier molybdenum doped in copper film, with molybdenum showing positive mixing enthalpy to copper and negative mixing enthalpy to nickel.. 2012-01-01.

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