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	A study of ultraprecision mechanical polishing of single-crystal silicon with laser nano-structured diamond abrasive by molecular dynamics simulation
	Dai, HF; Zhang, F; Chen, JB
刊名	INTERNATIONAL JOURNAL OF MECHANICAL SCIENCES
	2019
卷号	Vol.157页码:254-266
关键词	Molecular dynamics Laser nano-structured diamond abrasive Mechanical polishing Subsurface damage
ISSN号	0020-7403;1879-2162
URL标识	查看原文
公开日期	[db:dc_date_available]
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/4749706
专题	湖南大学
作者单位	1.Guizhou Univ, Coll Mech Engn, Guiyang 550025, Guizhou, Peoples R China 2.Hunan Univ, State Key Lab Adv Design & Mfg Vehicle Body, Changsha 410082, Hunan, Peoples R China 3.Ningbo Univ, Sch Mech Engn & Mech, Ningbo 315211, Zhejiang, Peoples R China
推荐引用方式 GB/T 7714	Dai, HF,Zhang, F,Chen, JB. A study of ultraprecision mechanical polishing of single-crystal silicon with laser nano-structured diamond abrasive by molecular dynamics simulation[J]. INTERNATIONAL JOURNAL OF MECHANICAL SCIENCES,2019,Vol.157:254-266.
APA	Dai, HF,Zhang, F,&Chen, JB.(2019).A study of ultraprecision mechanical polishing of single-crystal silicon with laser nano-structured diamond abrasive by molecular dynamics simulation.INTERNATIONAL JOURNAL OF MECHANICAL SCIENCES,Vol.157,254-266.
MLA	Dai, HF,et al."A study of ultraprecision mechanical polishing of single-crystal silicon with laser nano-structured diamond abrasive by molecular dynamics simulation".INTERNATIONAL JOURNAL OF MECHANICAL SCIENCES Vol.157(2019):254-266.

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