| An observation and explanation of interior cracking at the interface of solder by electromigration | |
| Wang, QZ; Liu, QY; Zhang, Z; Miao, M; Su, YH; Su, F | |
| 刊名 | MICROELECTRONICS RELIABILITY
 |
| 2019 | |
| 卷号 | Vol.97页码:79-84 |
| 关键词 | Electromigration (EM) Interfacial crack Solder Reliability |
| ISSN号 | 0026-2714 |
| URL标识 | 查看原文 |
| 公开日期 | [db:dc_date_available] |
| 内容类型 | 期刊论文 |
| URI标识 | http://www.corc.org.cn/handle/1471x/4749110 |
| 专题 | 湖南大学 |
| 作者单位 | 1.Beihang Univ, Sch Aeronaut Sci & Engn, Beijing, Peoples R China 2.Beijing Informat Sci & Technol Univ, Beijing, Peoples R China 3.Hunan Univ, Coll Elect & Informat Engn, Changsha, Hunan, Peoples R China |
| 推荐引用方式 GB/T 7714 | Wang, QZ,Liu, QY,Zhang, Z,et al. An observation and explanation of interior cracking at the interface of solder by electromigration[J]. MICROELECTRONICS RELIABILITY,2019,Vol.97:79-84. |
| APA | Wang, QZ,Liu, QY,Zhang, Z,Miao, M,Su, YH,&Su, F.(2019).An observation and explanation of interior cracking at the interface of solder by electromigration.MICROELECTRONICS RELIABILITY,Vol.97,79-84. |
| MLA | Wang, QZ,et al."An observation and explanation of interior cracking at the interface of solder by electromigration".MICROELECTRONICS RELIABILITY Vol.97(2019):79-84. |
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