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	Investigation of tool geometry in nanoscale cutting single-crystal copper by molecular dynamics simulation
	Dai, HF; Du, H; Chen, JB; Chen, GY
刊名	Proceedings of the Institution of Mechanical Engineers, Part J: Journal of Engineering Tribology
	2019
卷号	Vol.233 No.8页码:1208-1220
关键词	Molecular dynamics nanometric cutting tool geometry single-crystal copper subsurface damage
ISSN号	1350-6501;2041-305X
URL标识	查看原文
公开日期	[db:dc_date_available]
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/4747617
专题	湖南大学
作者单位	1.Guizhou Univ, Coll Mech Engn, Guiyang 550025, Guizhou, Peoples R China 2.Ningbo Univ, Sch Mech Engn & Mech, Ningbo, Zhejiang, Peoples R China 3.Hunan Univ, State Key Lab Adv Design & Mfg Vehicle Body, Changsha, Hunan, Peoples R China
推荐引用方式 GB/T 7714	Dai, HF,Du, H,Chen, JB,et al. Investigation of tool geometry in nanoscale cutting single-crystal copper by molecular dynamics simulation[J]. Proceedings of the Institution of Mechanical Engineers, Part J: Journal of Engineering Tribology,2019,Vol.233 No.8:1208-1220.
APA	Dai, HF,Du, H,Chen, JB,&Chen, GY.(2019).Investigation of tool geometry in nanoscale cutting single-crystal copper by molecular dynamics simulation.Proceedings of the Institution of Mechanical Engineers, Part J: Journal of Engineering Tribology,Vol.233 No.8,1208-1220.
MLA	Dai, HF,et al."Investigation of tool geometry in nanoscale cutting single-crystal copper by molecular dynamics simulation".Proceedings of the Institution of Mechanical Engineers, Part J: Journal of Engineering Tribology Vol.233 No.8(2019):1208-1220.

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